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課程名稱 |
雷射加工原理
Principles of Laser Materials Processing |
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開課學期 |
101-1 |
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授課對象 |
工學院 機械工程學系 |
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授課教師 |
李貫銘 |
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課號 |
ME5293 |
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課程識別碼 |
522 U5820 |
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班次 |
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學分 |
3 |
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全/半年 |
半年 |
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必/選修 |
選修 |
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上課時間 |
星期二5,6,7(12:20~15:10) |
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上課地點 |
工綜B02 |
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備註 |
本課程中文授課,使用英文教科書。預修課程：機械製造。
總人數上限：40人 |
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Ceiba 課程網頁 |
http://ceiba.ntu.edu.tw/1011Laser |
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課程簡介影片 |
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核心能力關聯 |
本課程尚未建立核心能力關連 |
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課程大綱
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為確保您我的權利,請尊重智慧財產權及不得非法影印
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課程概述 |
Introduction to laser material processing |
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課程目標 |
1. To provide students the background of laser material processing to prepare them for industry.
2. To present the related analytical theories for laser material processing.
3. To provide the latest development and applications of laser in the industry in recent years. |
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課程要求 |
Homework 20%
Midterm 40%
Term project 40%
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預期每週課後學習時數 |
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Office Hours |
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指定閱讀 |
Principles of Laser Materials Processing, by Elijah Kannatey-Asibu, Jr., John Wiley & Sons, Inc., Hoboken, N.J. |
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參考書目 |
1. Laser material processing by William M. Steen, 1991
2. Laser processing and analysis of materials by W.W. Duley
3. Laser processing of engineering materials : principles, procedure and industrial application by John C. Ion, 2005
4. Industrial lasers and their applications by James T. Luxon, David E. Parker, 1992
5. Laser materials processing edited by Michael Bass, 1983
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評量方式
(僅供參考) |
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No. |
項目 |
百分比 |
說明 |
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1. |
Homework and Quizzes |
50% |
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2. |
Midterm |
25% |
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3. |
Final Project |
25% |
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週次 |
日期 |
單元主題 |
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第1週 |
9/11 |
Introduction |
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第2週 |
9/18 |
Background on Laser Processing (Ch. 14) |
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第3週 |
9/25 |
Background on Laser Processing (Ch. 14) |
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第4週 |
10/02 |
Laser Cutting and Drilling (Ch. 15) |
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第5週 |
10/09 |
Laser Cutting and Drilling (Ch. 15) |
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第6週 |
10/16 |
Laser Welding (Ch. 16) |
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第7週 |
10/23 |
Laser Welding (Ch. 16) |
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第8週 |
10/30 |
Laser Surface Modification (Ch. 17) |
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第9週 |
11/06 |
Laser Surface Modification (Ch. 17) |
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第10週 |
11/13 |
Midterm |
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第11週 |
11/20 |
Laser Forming (Ch. 18) |
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第12週 |
11/27 |
Thermal Aspects (Ch. 10) |
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第13週 |
12/04 |
Thermal Aspects (Ch. 10) |
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第14週 |
12/11 |
Residual Stresses and Distortion (Ch. 13) |
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第15週 |
12/18 |
Process Monitoring (Ch. 21) |
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第16週 |
12/25 |
Oral presentations |
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第17週 |
1/01 |
Holiday (No class) |
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